Cypress Computer Hardware CY62146EV30 User Manual

CY62146EV30 MoBL®  
4-Mbit (256K x 16) Static RAM  
reduces power consumption by 80% when addresses are not  
toggling. The device can also be put into standby mode  
reducing power consumption by more than 99% when  
Features  
• Very high speed: 45 ns  
• Wide voltage range: 2.20V–3.60V  
• Pin compatible with CY62146DV30  
• Ultra low standby power  
deselected (CE HIGH). The input and output pins (IO through  
0
IO ) are placed in a high impedance state when:  
15  
• Deselected (CE HIGH)  
• Outputs are disabled (OE HIGH)  
— Typical standby current: 1 µA  
• Both Byte High Enable and Byte Low Enable are disabled  
(BHE, BLE HIGH)  
— Maximum standby current: 7 µA  
• Ultra low active power  
• Write operation is active (CE LOW and WE LOW)  
— Typical active current: 2 mA @ f = 1 MHz  
• Easy memory expansion with CE, and OE features  
• Automatic power down when deselected  
• CMOS for optimum speed and power  
Write to the device by taking Chip Enable (CE) and Write  
Enable (WE) inputs LOW. If Byte Low Enable (BLE) is LOW,  
then data from IO pins (IO through IO ), is written into the  
0
7
location specified on the address pins (A through A ). If Byte  
0
17  
High Enable (BHE) is LOW, then data from IO pins (IO  
8
• Available in a Pb-free 48-ball VFBGA and 44-pin TSOP II  
packages  
through IO ) is written into the location specified on the  
15  
address pins (A through A ).  
0
17  
Read from the device by taking Chip Enable (CE) and Output  
Enable (OE) LOW while forcing the Write Enable (WE) HIGH.  
If Byte Low Enable (BLE) is LOW, then data from the memory  
Functional Description [1]  
The CY62146EV30 is a high performance CMOS static RAM  
organized as 256K words by 16 bits. This device features  
advanced circuit design to provide ultra low active current.  
location specified by the address pins appear on IO to IO . If  
0
7
Byte High Enable (BHE) is LOW, then data from memory  
appears on IO to IO . See the “Truth Table” on page 9 for a  
®
This is ideal for providing More Battery Life™ (MoBL ) in  
8
15  
portable applications such as cellular telephones. The device  
also has an automatic power down feature that significantly  
complete description of read and write modes.  
Product Portfolio  
Power Dissipation  
Speed  
(ns)  
Product  
V
Range (V)  
Operating I (mA)  
CC  
CC  
Standby I  
(µA)  
SB2  
f = 1 MHz  
f = f  
max  
[2]  
[2]  
[2]  
Min  
Typ  
Max  
Typ  
Max  
Typ  
15  
Max  
20  
Typ  
Max  
CY62146EV30LL  
2.2  
3.0  
3.6  
45 ns  
2
2.5  
1
7
Notes:  
1. For best practice recommendations, please refer to the Cypress application note System Design Guidelines on http://www.cypress.com.  
2. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at V = V , T = 25°C.  
CC  
CC(typ)  
A
Cypress Semiconductor Corporation  
Document #: 38-05567 Rev. *C  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised March 26, 2007  
 
   
CY62146EV30 MoBL®  
DC Input Voltage  
........... –0.3V to 3.9V (V  
+ 0.3V)  
Maximum Ratings  
CC max  
Output Current into Outputs (LOW) ............................ 20 mA  
Exceeding the maximum ratings may impair the useful life of  
the device. These user guidelines are not tested.  
Static Discharge Voltage ......................................... >2001V  
(per MIL-STD-883, Method 3015)  
Storage Temperature ................................65°C to + 150°C  
Latch-up Current ..................................................... >200 mA  
Ambient Temperature with  
Power Applied ...........................................55°C to + 125°C  
Operating Range  
Supply Voltage to Ground  
Ambient  
Potential .............................–0.3V to + 3.9V (V  
+ 0.3V)  
+ 0.3V)  
CCmax  
Device  
Range  
Temperature  
V
CC  
DC Voltage Applied to Outputs  
CY62146EV30 Industrial –40°C to +85°C 2.2V to 3.6V  
in High-Z State  
................–0.3V to 3.9V (V  
CCmax  
Electrical Characteristics (Over the Operating Range)  
45 ns  
Parameter  
Description  
Test Conditions  
= –0.1 mA  
Min  
2.0  
2.4  
Typ  
Max  
Unit  
V
V
Output HIGH Voltage  
I
I
I
I
OH  
OL  
IH  
OH  
OH  
OL  
OL  
= –1.0 mA, V > 2.70V  
V
CC  
V
V
V
I
Output LOW Voltage  
Input HIGH Voltage  
Input LOW Voltage  
= 0.1 mA  
0.4  
0.4  
V
= 2.1 mA, V > 2.70V  
V
CC  
V
V
V
V
= 2.2V to 2.7V  
= 2.7V to 3.6V  
= 2.2V to 2.7V  
= 2.7V to 3.6V  
1.8  
2.2  
V
V
+ 0.3  
V
CC  
CC  
CC  
CC  
CC  
CC  
+ 0.3  
V
–0.3  
–0.3  
–1  
0.6  
V
IL  
0.8  
+1  
+1  
20  
V
Input Leakage Current  
Output Leakage Current  
GND < V < V  
CC  
µA  
µA  
mA  
IX  
I
I
I
GND < V < V , Output Disabled  
–1  
OZ  
O
CC  
V
Operating Supply Current f = f  
= 1/t  
V
= V  
CC(max),  
15  
CC  
CC  
max  
RC  
CC  
I
= 0 mA  
OUT  
f = 1 MHz  
2
1
2.5  
CMOS levels  
I
Automatic CE Power down  
Current — CMOS Inputs  
7
µA  
µA  
SB1  
CE > V 0.2V,  
CC  
V
f = f  
> V –0.2V or V < 0.2V  
CC IN  
IN  
(Address and Data Only),  
max  
f = 0 (OE, BHE, BLE and WE), V = 3.60V  
CC  
I
Automatic CE Power down  
Current — CMOS Inputs  
1
7
CE > V – 0.2V,  
SB2  
CC  
V
> V – 0.2V or V < 0.2V,  
CC IN  
IN  
f = 0, V = 3.60V  
CC  
Notes:  
5. V  
= –2.0V for pulse durations less than 20 ns.  
IL(min)  
6. V  
= V + 0.75V for pulse durations less than 20 ns.  
IH(max)  
CC  
7. Full device AC operation assumes a minimum of 100 µs ramp time from 0 to V (min) and 200 µs wait time after V stabilization.  
cc  
cc  
8. Only chip enable (CE) and byte enables (BHE and BLE) need to be tied to CMOS levels to meet the I  
/ I  
spec. Other inputs can be left floating.  
SB2 CCDR  
Document #: 38-05567 Rev. *C  
Page 3 of 12  
 
       
CY62146EV30 MoBL®  
[9]  
Capacitance (For All Packages)  
Parameter  
Description  
Input Capacitance  
Output Capacitance  
Test Conditions  
T = 25°C, f = 1 MHz,  
Max  
10  
Unit  
pF  
C
IN  
A
V
= V  
CC  
CC(typ)  
C
10  
pF  
OUT  
Thermal Resistance [9]  
VFBGA  
Package  
TSOP II  
Package  
Parameter  
Description  
Test Conditions  
Unit  
Θ
Thermal Resistance Still Air, soldered on a 3 × 4.5 inch,  
(Junction to Ambient) two-layer printed circuit board  
75  
10  
77  
13  
°C/W  
JA  
Θ
Thermal Resistance  
(Junction to Case)  
°C/W  
JC  
AC Test Loads and Waveforms  
R1  
ALL INPUT PULSES  
90%  
10%  
V
CC  
V
CC  
OUTPUT  
90%  
10%  
GND  
R2  
30 pF  
Rise Time = 1 V/ns  
Fall Time = 1 V/ns  
INCLUDING  
JIG AND  
SCOPE  
Equivalent to: THEVENIN EQUIVALENT  
R
TH  
OUTPUT  
V
Parameters  
2.50V  
16667  
15385  
8000  
3.0V  
Unit  
R1  
R2  
1103  
1554  
645  
R
TH  
V
1.20  
1.75  
V
TH  
Data Retention Characteristics (Over the Operating Range)  
Parameter  
Description  
for Data Retention  
CC  
Conditions  
Min  
Typ  
Max  
Unit  
V
V
V
1.5  
DR  
I
Data Retention Current  
V
V
= 1.5V, CE > V – 0.2V,  
0.8  
7
µA  
CCDR  
CC  
IN  
CC  
> V – 0.2V or V < 0.2V  
CC  
IN  
t
t
Chip Deselect to Data Retention Time  
Operation Recovery Time  
0
ns  
ns  
CDR  
R
t
RC  
Data Retention Waveform  
DATA RETENTION MODE  
> 1.5V  
V
V
V
VCC  
CE  
CC(min)  
CC(min)  
DR  
t
t
R
CDR  
Notes:  
9. Tested initially and after any design or process changes that may affect these parameters.  
10. Full device operation requires linear V ramp from V to V > 100 µs or stable at V > 100 µs.  
CC(min)  
CC  
DR  
CC(min)  
Document #: 38-05567 Rev. *C  
Page 4 of 12  
 
     
CY62146EV30 MoBL®  
Switching Characteristics (Over the Operating Range)  
45 ns  
Parameter  
Read Cycle  
Description  
Min  
45  
Max  
Unit  
t
t
t
t
t
t
t
t
t
t
t
t
t
t
Read Cycle Time  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
RC  
Address to Data Valid  
45  
AA  
Data Hold from Address Change  
10  
OHA  
ACE  
DOE  
LZOE  
HZOE  
LZCE  
HZCE  
PU  
45  
22  
CE LOW to Data Valid  
OE LOW to Data Valid  
5
10  
0
OE LOW to Low-Z  
18  
18  
OE HIGH to High-Z  
CE LOW to Low-Z  
CE HIGH to High-Z  
CE LOW to Power Up  
45  
22  
CE HIGH to Power Down  
BLE / BHE LOW to Data Valid  
PD  
DBE  
LZBE  
HZBE  
5
BLE / BHE LOW to Low-Z  
18  
BLE / BHE HIGH to High-Z  
Write Cycle  
t
t
t
t
t
t
t
t
t
t
t
Write Cycle Time  
45  
35  
35  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
WC  
CE LOW to Write End  
SCE  
AW  
Address Setup to Write End  
Address Hold from Write End  
Address Setup to Write Start  
HA  
0
SA  
35  
35  
25  
0
WE Pulse Width  
PWE  
BW  
BLE / BHE LOW to Write End  
Data Setup to Write End  
SD  
Data Hold from Write End  
HD  
18  
WE LOW to High-Z  
HZWE  
LZWE  
10  
WE HIGH to Low-Z  
Notes:  
11. Test conditions for all parameters other than tri-state parameters assume signal transition time of 3 ns (1V/ns) or less, timing reference levels of V  
/2, input  
CC(typ)  
pulse levels of 0 to V  
, and output loading of the specified I /I as shown in the “AC Test Loads and Waveforms” on page 4.  
CC(typ)  
OL OH  
12. AC timing parameters are subject to byte enable signals (BHE or BLE) not switching when chip is disabled. Please see application note AN13842 for further  
clarification.  
13. At any given temperature and voltage condition, t  
given device.  
is less than t  
, t  
is less than t  
, t  
is less than t  
, and t  
is less than t  
for any  
HZCE  
LZCE HZBE  
LZBE HZOE  
LZOE  
HZWE  
LZWE  
14. t  
, t  
, t  
, and t  
transitions are measured when the outputs enter a high impedence state.  
HZOE HZCE HZBE  
HZWE  
15. The internal write time of the memory is defined by the overlap of WE, CE = V , BHE and/or BLE = V . All signals must be ACTIVE to initiate a write and any of  
IL  
IL  
these signals can terminate a write by going INACTIVE. The data input setup and hold timing must be referenced to the edge of the signal that terminates the write.  
Document #: 38-05567 Rev. *C  
Page 5 of 12  
 
         
CY62146EV30 MoBL®  
Switching Waveforms  
Read Cycle 1 (Address Transition Controlled)  
t
RC  
ADDRESS  
t
AA  
t
OHA  
PREVIOUS DATA VALID  
DATA VALID  
DATA OUT  
Read Cycle No. 2 (OE Controlled)  
ADDRESS  
CE  
t
RC  
t
PD  
HZCE  
t
t
ACE  
OE  
t
HZOE  
t
DOE  
t
LZOE  
BHE/BLE  
t
HZBE  
t
DBE  
t
LZBE  
HIGH  
IMPEDANCE  
HIGHIMPEDANCE  
DATA VALID  
DATA OUT  
t
LZCE  
t
PU  
V
50%  
50%  
CC  
I
SUPPLY  
SB  
CURRENT  
Notes:  
16. The device is continuously selected. OE, CE = V , BHE and/or BLE = V .  
IL  
IL  
17. WE is HIGH for read cycle.  
18. Address valid before or similar to CE and BHE, BLE transition LOW.  
Document #: 38-05567 Rev. *C  
Page 6 of 12  
 
     
CY62146EV30 MoBL®  
Switching Waveforms (continued)  
[15, 19, 20]  
Write Cycle No. 1 (WE Controlled)  
t
WC  
ADDRESS  
CE  
tSCE  
t
t
HA  
AW  
t
SA  
t
PWE  
WE  
t
BW  
BHE/BLE  
OE  
t
HD  
t
SD  
DATA IO  
DATAIN  
t
HZOE  
Write Cycle No. 2 (CE Controlled)  
t
WC  
ADDRESS  
CE  
t
SCE  
t
SA  
t
t
HA  
AW  
tPWE  
WE  
t
BW  
BHE/BLE  
OE  
t
t
SD  
HD  
DATAIN  
DATA IO  
t
HZOE  
Notes:  
19. Data IO is high impedance if OE = V  
.
IH  
20. If CE goes HIGH simultaneously with WE = V , the output remains in a high impedance state.  
IH  
21. During this period, the IOs are in output state and input signals must not be applied.  
Document #: 38-05567 Rev. *C  
Page 7 of 12  
 
     
CY62146EV30 MoBL®  
Switching Waveforms (continued)  
Write Cycle No. 3 (WE Controlled, OE LOW)  
t
WC  
ADDRESS  
CE  
t
SCE  
t
BW  
BHE/BLE  
t
t
HA  
AW  
t
SA  
t
PWE  
WE  
t
HD  
t
SD  
DATA IO  
DATAIN  
t
LZWE  
t
HZWE  
Write Cycle No. 4 (BHE/BLE Controlled, OE LOW)  
t
WC  
ADDRESS  
CE  
t
SCE  
t
t
HA  
AW  
tBW  
BHE/BLE  
t
SA  
tPWE  
WE  
tHZWE  
t
HD  
t
SD  
DATAIN  
DATA IO  
tLZWE  
Document #: 38-05567 Rev. *C  
Page 8 of 12  
 
CY62146EV30 MoBL®  
Truth Table  
CE  
H
L
WE  
X
OE  
X
BHE  
X
BLE  
X
Inputs/Outputs  
High-Z  
High-Z  
Data Out (IO –IO  
Mode  
Power  
Standby (I  
Deselect/Power down  
Output Disabled  
Read  
)
SB  
X
X
H
H
Active (I  
Active (I  
Active (I  
)
CC  
L
H
L
L
L
)
)
CC  
0
15  
L
H
L
H
L
Data Out (IO –IO );  
Read  
)
CC  
0
7
IO –IO in High-Z  
8
15  
L
H
L
L
H
Data Out (IO –IO );  
Read  
Active (I  
)
8
15  
CC  
IO –IO in High-Z  
0
7
L
L
L
L
L
H
H
H
L
H
H
H
X
X
L
H
L
L
L
H
L
L
High-Z  
Output Disabled  
Output Disabled  
Output Disabled  
Write  
Active (I  
Active (I  
Active (I  
Active (I  
Active (I  
)
CC  
High-Z  
High-Z  
)
CC  
)
CC  
L
Data In (IO –IO  
)
)
CC  
0
15  
L
H
Data In (IO –IO );  
Write  
)
CC  
0
7
IO –IO in High-Z  
8
15  
L
L
X
L
H
Data In (IO –IO );  
Write  
Active (I  
)
CC  
8
15  
IO –IO in High-Z  
0
7
Ordering Information  
Speed  
(ns)  
Package  
Diagram  
Operating  
Range  
Ordering Code  
Package Type  
45  
CY62146EV30LL-45BVXI 51-85150 48-ball VFBGA (Pb-free)  
CY62146EV30LL-45ZSXI 51-85087 44-pin TSOP II (Pb-free)  
Industrial  
Please contact your local Cypress sales representative for availability of other parts  
Document #: 38-05567 Rev. *C  
Page 9 of 12  
 
 
CY62146EV30 MoBL®  
Package Diagrams  
Figure 1. 48-ball VFBGA (6 x 8 x 1 mm), 51-85150  
BOTTOM VIEW  
A1 CORNER  
TOP VIEW  
Ø0.05 M C  
Ø0.25 M C A B  
Ø0.30 0.05(48X)  
A1 CORNER  
1
2
3
4
5
6
6
5
4
3
2
1
A
A
B
C
D
B
C
D
E
E
F
F
G
G
H
H
1.875  
A
A
0.75  
B
6.00 0.10  
3.75  
B
6.00 0.10  
0.15(4X)  
SEATING PLANE  
C
51-85150-*D  
Document #: 38-05567 Rev. *C  
Page 10 of 12  
 
CY62146EV30 MoBL®  
Package Diagrams (continued)  
Figure 2. 44-pin TSOP II, 51-85087  
51-85087-*A  
MoBL is a registered trademark, and More Battery Life is a trademark of Cypress Semiconductor. All product and company names  
mentioned in this document are the trademarks of their respective holders.  
Document #: 38-05567 Rev. *C  
Page 11 of 12  
© Cypress Semiconductor Corporation, 2006-2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for  
the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended  
to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize  
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress  
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.  
 
CY62146EV30 MoBL®  
Document History Page  
®
Document Title:CY62146EV30 MoBL , 4-Mbit (256K x 16) Static RAM  
Document Number: 38-05567  
Orig. of  
REV.  
**  
ECN NO. Issue Date Change  
Description of Change  
223225  
247373  
See ECN  
See ECN  
AJU  
SYT  
New Data Sheet  
*A  
Changed Advance Information to Preliminary  
Moved Product Portfolio to Page 2  
Changed V stabilization time in footnote #8 from 100 µs to 200 µs  
CC  
Removed Footnote #14(t  
) from Previous revision  
LZBE  
Changed I  
from 2.0 µA to 2.5 µA  
CCDR  
Changed typo in Data Retention Characteristics(t ) from 100 µs to t ns  
R
RC  
Changed t  
Changed t  
from 6 ns to 10 ns for both 35 ns and 45 ns Speed Bin  
OHA  
, t  
, t  
from 12 to 15 ns for 35 ns Speed Bin and 15 to  
HZOE HZBE HZWE  
18 ns for 45 ns Speed Bin  
Changed t and t from 25 to 30 ns for 35 ns Speed Bin and 40 to 35 ns  
SCE  
BW  
for 45 ns Speed Bin  
Changed t from 12 to 18 ns for 35 ns Speed Bin and 15 to 22 ns for 45  
HZCE  
ns Speed Bin  
Changed t from 15 to 18 ns for 35 ns Speed Bin and 20 to 22 ns for  
SD  
45 ns Speed Bin  
Changed t  
Changed t  
from 15 to 18 ns for 35 ns Speed Bin  
from 15 to 18 ns for 35 ns Speed Bin  
DOE  
DBE  
Changed Ordering Information to include Pb-Free Packages  
*B  
414807  
See ECN  
ZSD  
Changed from Preliminary information to Final  
Changed the address of Cypress Semiconductor Corporation on Page #1  
from “3901 North First Street” to “198 Champion Court”  
Removed 35ns Speed Bin  
Removed “L” version of CY62146EV30  
Changed ball E3 from DNU to NC  
Removed the redundant foot note on DNU.  
Changed I (Max) value from 2 mA to 2.5 mA and I (Typ) value from  
CC  
CC  
1.5 mA to 2 mA at f=1 MHz  
Changed I (Typ) value from 12 mA to 15 mA at f = f  
CC  
max  
Changed I  
and I  
Typ values from 0.7 µA to 1 µA and Max values from  
SB1  
SB2  
2.5 µA to 7 µA.  
Changed the AC test load capacitance from 50pF to 30pF on Page# 4  
Changed I from 2.5 µA to 7 µA.  
CCDR  
Added I  
typical value.  
CCDR  
Changed t  
Changed t  
Changed t  
Changed t  
Changed t  
from 3 ns to 5 ns  
LZOE  
LZCE  
LZBE  
HZCE  
PWE  
and t  
from 6 ns to 10 ns  
LZWE  
from 6 ns to 5 ns  
from 22 ns to 18 ns  
from 30 ns to 35 ns.  
Changed t from 22 ns to 25 ns.  
SD  
Updated the package diagram 48-ball VFBGA from *B to *D  
Updated the ordering information table and replaced the Package Name  
column with Package Diagram.  
*C  
925501  
See ECN  
VKN  
Added footnote #8 related to I  
Added footnote #12 related AC timing parameters  
and I  
SB2 CCDR  
Document #: 38-05567 Rev. *C  
Page 12 of 12  
 

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